SimScale simulation projects by cdumont | Page 1

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Electronics Cooling analysis of a simple TEC cooled device. - Copy

The presented project is an analysis of the thermal performance of a heat sink connected to chip. The chip acts as a power source generating 30W of heat. Using a conjugate heat transfer analysis allows for simulation of heat transfer between the solids via conduction and the dissipation of heat into the ambient fluid via convection. The components are cooled passively and buoyancy effects  drive the flow in the surrounding air.

The objective of this project is to evaluate the max temperature of the chip during operation and therefore a steady state analysis was carried out. - Copy

Cold Room CFD simulation of air flow from evaporators and humidifiers. - Copy

sustainable electric cable testing - Copy

Thermal Analysis of a Differential Casing

Tutorial project for a thermal analysis of a differential casing. The project only provides the geometry to start with. See our tutorials section to have a look at the step-by-step instructions to set up the simulation.

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