Hey all,
I did the thermal analysis for the PCB but I do not know if the calculation is correct or not, please can anyone check
Hi @abdelazeem043 ,
I know I am helping you on the other thread, but I also took a look at your simulation. For the only sim with results (Conjugate Heat Transfer 2.0), in general your setup is sound. A few bits of feedback:
1.) If you are not modeling an enclosure, you would want to make the outer box a bit larger in the X/Y directions, and you could place the lower face coincident (or below by a few cm) with the bottom of the PCB. The sidewalls and inlet/outlet being too close can affect your results, and it is just wasted mesh to go that far down below the unit of interest.
2.) Keep in mind that the volumetric power source is applied to all bodies, not spread out amongst them (not sure which you assumed here). In other words, each MOSFET is dumping 50 W (300W total) into the domain.
3.) If you have a fan supplying cooling flow to the board, you should model this w/ a cylindrical fan momentum source, rather than spreading the flow out over the large velocity inlet.
Without seeing a sketch of your problem setup, it’s hard to know whether your simulation is “correct”. How do the results compare to your expectations? Also, I see you are out of community simulation quota…have you discussed upgrading to a Pro account to continue your study (and for future work)?
Thanks,
–Nolan