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Parcial de Mecánica de los fluidos computacional

In this simulation, we are performing conjugated heat transfer analysis on a graphics card with 2 types of mesh conditions. Heat is the biggest problem in electronics, it can reduce life of the part. It is necessary that electronics work in certain limits for longer life.

This project was based on the problem encountered by the sediment, which occupied most of the volume of the dam.  Certain components were considered and simulated in order for this process to be successful.

Projeto térmico e hidráulico de um trocador de calor casco e tubos.

This Project is to study the flow of heat from Heat Block to other extruder components

thermal dissipation on PCB with 2 sources

Thermal contraction of a copper block from RT to cryo

detection of co2 level in computer lab using simulation

This simulation aims to simulate the static forces acting on a cutting tool insert and support under the following conditions.
 The final turning tool insert characteristics were:
ap 1.8 mm (0.3-4.2)
fn 0.19 mm/rev. (0.09-0.28)
C 225 m/min. (310-150)
The characteristics of the cutting tool shank:
Tool cutting edge angle: 75
Tool lead angle: 15
The cutting condition of the task was:
depth of cut (t) 2 mm
feed 0.2 mm/rev.
cutting speed 200 m/min
cutting material, C45 (DIN)
The forces acting on  the cutting area are:
Fx: -1436.5N
Fy: 1447.8N
Fz: -180.2N

This project contains the geometry of the extruder for the first homework assignment of the 3D Printing workshop.

An electric soldering Gun is to be powered by an oscillating current. An oscillating heat generation is applied to the tip of the model to simulate this power cycle.

Agenda is to perform time-varying Heat Transfer analysis and examine the temperature distribution.

Transient room temperature increase in absence of ventilation

Simulation of led pcb heat sink
thermal description
led thermal management system

evaluation of thermal comfort in a mini power house

Using a heat spreader to reduce micro processor temp.

In this module, I just want to simulate the thermal analysis

Simulation of air conditioning currents in an office, with curtain wall, with and without UV adhesive sun protection

To  check if cooling can be done without pump

To increase the placement speed of the AFP

thermal simulation | SimScale Project Library | Page 3