Looking for heat sink simulation templates? Sign up for SimScale and join the largest engineering simulation community in the world! | Page 2

CFD Analysis to test the performance of a Plate fin heat sink

The presented project is an analysis of the thermal performance of a heat sink connected to chip. The chip acts as a power source generating 30W of heat. Using a conjugate heat transfer analysis allows for simulation of heat transfer between the solids via conduction and the dissipation of heat into the ambient fluid via convection. The components are cooled passively and buoyancy effects  drive the flow in the surrounding air.

The objective of this project is to evaluate the max temperature of the chip during operation and therefore a steady state analysis was carried out.

study state and transient thermal analysis of heat sink, finding temperature distribution over the fin surface

The cooling mechanism is very crucial to ensure the rated performance of CPU, at the same time it accounts for the major operating cost of the system. Therefore, an efficient electronics cooling is necessary to provide the continuous operations at low operating costs. Tools of computational Fluid Dynamics are widely being used to optimize the cooling mechanism of the chips. In this study the focus is on finding the optimum heat sink design for electronics cooling.

In this project, thermal solvers of SimScale are validated by simulating high power LED packaging with different on sink placement.

heat sink | SimScale Project Library | Page 2