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Brak wentylacji, 134 diody (67 w symetrii) każda po 1W mocy. PCB ze zmienionym przewodnictwem ciepła.

To evaluate different Heatsink mounting orientations.

Internal Natural Convection Electronics Cooling Demo 2

Demo of cooling of Raspberry Pi using the Immersed Boundary Method (IBM). 
IBM makes CAD cleanup and defeaturing obsolete. A CAD with detailed electronic features (pins, connectors, engravings, etc.) can be directly imported as is for simulation
In this demo a Raspberry Pi is overclocked and the heat transfer behaviour is compared for two cases where the fan is off and on.

Demonstration project of an electronics enclosure using CHT v2. Comparison different passive heat sink designs and comparison of active and passive cooling

natural convection cooling of a thermoelectric generator setup with heatplate including radiation

Electronics packaging with forced cooling. Find the best location for the fan, outlet ventilation locations etc.

Thermal analysis of cooling system for solar panels

Aim to show electronics cooling and airflow inside a Stewart platform.

Carry out conjugate heat transfer analysis with 2021 battery segment including busbars. The goal is to find the size the fan by finding the right air flow rate to keep cell temperature in check

Thermal analysis of an active heatsink to cool a microprocessor

Testing out a CPU cooler with a copper Vapor Chamber and Copper HeatSink

Thermal simulation of electronics in a housing.

To impart cooling to the electronic components

Calculate the Fin thickness and heat dissipation

Calculate the area and Fin thickness required heat dissipation

Conjugate heat transfer simulation to analyse the thermal performance of water cooled transistors.

Heat transfer simulation of a cooling plate to determine the resulting temperature and heat flux distribution. This project is carried out for the partial fulfillment  of Homework Session of the FEA in Formula Student and Formula SAE Workshop.
Water is circulated through the water jackets inside the plates for the water convection purpose  also convection of air acts on the outer surfaces of the plates.

Setup of Heatsink Simulation for comparison to fusion electronic cooling.

Simulation of led pcb heat sink
thermal description
led thermal management system

CFD Cooling electronics inside of cabinet

This project deals with simulating the flow through the graphic card at different fan Rpms using the Multiple reference frame(MRF) rotational zone concept. A conjugate heat transfer analysis will be performed to keep a check on thermal throttling of the GPU.

The goal of this project is to simulate the simplified version of the cooling system of the HP Workstation Notebook.
This is a Conjugate Heat Transfer (CHT) problem. Incompressible turbulent flow was assigned for the air flow. Two cooling scenarios are going to be investigated
1- Current cooling system 
2- External cooling fan assisted system

The presented project is an analysis of the thermal performance of a heat sink connected to chip. The chip acts as a power source generating 30W of heat. Using a conjugate heat transfer analysis allows for simulation of heat transfer between the solids via conduction and the dissipation of heat into the ambient fluid via convection. The components are cooled passively and buoyancy effects  drive the flow in the surrounding air.

The objective of this project is to evaluate the max temperature of the chip during operation and therefore a steady state analysis was carried out.

Comparing a coupe of LED designs - can we improve the efficiency without adding active cooling.

electronics cooling | SimScale Project Library | Page 1