A simple two-layer thermal model for a processor.  Layer 1 os the silicon die and layer 2 is heat spreader. To model heat sink we have placed an isothermal layer (maintained at the ambient temperature ) on the top of the heat spreader. | Simulation project by svarshney

A simple two-layer thermal model for a processor.  Layer 1 os the silicon die and layer 2 is heat spreader. To model heat sink we have placed an isothermal layer (maintained at the ambient temperature ) on the top of the heat spreader.

2D chip Heat Model

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