SimScale simulation projects by cnicoloff | Page 1

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FEAST at 2W dissipation, determining a rough steady state temperature.

Air cooling from behind a silicon wafer with a hot component on top that is radiating into a trapped air volume.

Examining how thermal vias affect the air cooling of silicon.

Attempting to cool the silicon with forced air convection so the ICs don't get too hot.

This project shows an electronic cooling application of ICs on PCB using the conjugate heat transfer transfer technique, abbreviated as CHT. Conjugate heat transfer defines processes which involve variations of temperature within solids and fluids due to thermal interaction.

Copy of the conjugate heat transfer test settings.

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