Thermomechanical

This analysis type is used to determine the structural and thermal stress of a solid object subjected to thermal and structural loads. First the temperature field is solved and then applied as a load for the structural analysis. | Page 39

This project shows the thermo-structural analysis of a 8 pin Small Outline Integrated Circuit (SOIC) chip with applied heat flux on the main chip core surfaces. It is a copy from another public project made by @ahmedhussain18 but this time the simulaiton ran using Code_Aster.

study thermal deformation in heated steel

TEMPERATURE DEFORMATION  
FIXED WITH SCREW

Analisis de tranferencia de calor en un disipador

Anális de transferencia de calor en un disipador

analisis de transferencia de calor en un disipador

Análisis de transferencia de calor en un disipador

Analisis del diseño del disipador de calor

Goal: Determine the thermal stress between pin and sample, and between sample and aligning rod.

Attempt to analyse and reduce thermal stress

Twenty CSP receivers with bellows shading and uneven temperature profile, FEA thermomechanical run, realistic support stiffness

1st attempt for the sinusoidal heating of plate with defects.

Calculate  maximum stress due to thermal contraction

Thermomechanical | SimScale Project Library | Page 39