SimScale simulation projects by carla_ap_felipe | Page 1

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Setup and analysis of electronics cooling on an electronics box containing different electronic components being cooled by the airflow of a fan.

This advanced thermal management tutorial describes the setup and analysis of electronics cooling on an electronics box containing different electronic components being cooled by the airflow of a fan. - Copy

This advanced thermal management tutorial describes the setup and analysis of electronics cooling on an electronics box containing different electronic components being cooled by the airflow of a fan.

The presented project is an analysis of the thermal performance of a heat sink connected to chip. The chip acts as a power source generating 30W of heat. Using a conjugate heat transfer analysis allows for simulation of heat transfer between the solids via conduction and the dissipation of heat into the ambient fluid via convection. The components are cooled passively and buoyancy effects  drive the flow in the surrounding air.

The objective of this project is to evaluate the max temperature of the chip during operation and therefore a steady state analysis was carried out. - Copy

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