Optimize Electronics Package Cooling with CFD (New WB)

About this project

A problem of interest of the electronics industry is the cooling of equipments in electronics package and the associated ventilation system project to guarantee the optimal operational conditions. The relevance of the proper operation of electronic equipment increases considerably when high economical costs, performance reduction and safety are involved. The appropriate operational conditions of the electronic components happen when the working temperature of the equipment installed in the rack is inside a safety project temperature margin. Therefore, the analysis and modelling of conjugate heat transfer processes for electronics package design becomes mandatory. This project presents a parametric study considering optimization of fresh air inlet flow rate in electronic equipment.