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Conjugate Heat Transfer Analysis of a PCB with thermal vias

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About this project

The mean goal of this project is knowing the behaviour of the heat transfer among a PCB and 3 components and analyze the benefits of using thermal vias. A CHT simulation will be used as well as a Laminar turbulence model and a Steady-State time dependency. This is a school project.

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Project History

  • YohanCurbelo

    YohanCurbelo created this project