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Heat transfer: Electronic design

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IC-package - Geometry
Geometry
3D
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Shashi91
Shashi91
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geometries 1 Geometry
meshes 1 Mesh
simulations 1 Simulation setup
runs 1 Result
About this project

Validation project: Heat transfer analysis of a high-power IC package containing die, thermal interface material, lid and heatsinks,

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Project History

  • Shashi91

    Shashi91 created this project